József Hlinka , Zoltán Weltsch ,


The article aims to discuss the effect of surface treatment on the wettability between DC01 steel and SAC305 lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of steel and affect the wetting properties. The surfaces of steel plates were treated by Nd:YAG laser with different laser powers. After the laser surface treatment wetting experiments were performed between the steel plates and lead- free solder paste. The effect of laser treatment on steel surface microstructure was analyzed by optical microscopy The experimental results showed that the wetting contact angles do not change up to 700 W laser power.


Keywords: laser treatment, solder paste, soldering, steel, wettability,


[1] M. Judd and K. Brindley, Soldering in Electronics Assembly, Oxford, Newnes, 1999.
[2] K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability, New York, Springer, 2007.
[3] F. G. Yost, F. M. Hosking and D. R. Frear, The Mechanics of Solder Alloy Wetting and Spreading, New York, VanNostrand Reinhold, 1993.
[4] Z. Zhao, C. Wang, M. Li, L. Wang, and L. Kong, “The effects of pulsed Nd:YAG laser irradiation on surface energyof copper,” Applied Surface Science, Vol. 252, pp. 4257–4263., 2006.
[5] J. Hlinka, M. Berczeli, G. Buza and Z. Weltsch, “Wetting properties of Nd:YAG laser treated copper by SACsolders,” Soldering & Surface Mount Technology, Vol. 29 Issue: 2, pp. 69-74, 2017. DOI 10.1108/SSMT-01-2016-0003.
[6] J. Lawrence and L. Li, Laser Modification of the Wettability Characteristics of Engineering Materials, UK,Professional Engineering Publishing Limited, London and Bury St Edmunds, 2001.
[7] J. Lawrence and L. Li, “Wettability characteristics of a modified mild steel with CO2, Nd:YAG, excimer and highpower diode lasers,” Journal of Physics D: Applied Physics, Vol. 32, pp. 2311-2318, 1999.
[8] L. Hao and J. Lawrence, “CO2 laser induced microstructure features in magnesia partially stabilised zirconiabioceramic and effects thereof on the wettability characteristics,” Materials Science and Engineering, Vol. A 364,pp. 171–181, 2004.
[9] M. Abtew and G. Selvaduray, “Lead-free Solders in Microelectronics,” Materials and Science Engineering Reports,Vol. 27, pp. 95–141., 2000.
[10] N. Sobczak, M. Singh, and R. Asthana, “High-temperature wettability measurements in metal/ceramic systems –some methodological issues,” Current Opinion in Solid State and Materials Science, Vol. 9, pp. 241–253., 2005.
[11] Technical Bulletin M705-GRN360-K [Online]. Available: [Accessed: 31-Mar-2016].

Copyright (c) 2019 Gradus